Samsung Electronics, a world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 12-gigabyte (GB) low-power double data rate 4X (LPDDR4X) UFS-based multichip package (uMCP). The announcement was made as part of the company’s annual Samsung Tech Day at its Device Solutions’ America headquarters in San Jose, California.
“Leveraging our leading-edge 24-gigabit (Gb) LPDDR4X chips, we can offer the highest mobile DRAM capacity of 12 GB not only for high-end smartphones but also for mid-range devices,” said Sewon Chun, executive vice president of Memory Marketing at Samsung Electronics. “Samsung will continue to support our smartphone-manufacturing customers with on-time development of next-generation mobile memory solutions, bringing enhanced smartphone experiences to many more users around the globe.”
Samsung is introducing its 12 GB uMCP solution just seven months after its launch of a 12 GB LPDDRX package based on 16Gb DRAM. By combining four of the 24Gb LPDDR4X chips (featuring the latest 1y-nanometer process technology) and ultra-fast eUFS 3.0 NAND storage into a single package, the new mobile memory is able to break through the current 8 GB package limit and provide 10+ GB memory to the broader smartphone market.*
As the trend toward larger, higher-resolution smartphone displays continues to grow, more users will benefit from Samsung’s uMCP solution when running data-intensive tasks or multitasking. With 1.5X capacity of the previous 8 GB package and a data transfer rate of 4,266 megabits per second (Mbps), the 12 GB uMCP can support smooth 4K video recording as well as accommodate AI and machine learning features even for mid-end smartphones.
Samsung plans to rapidly expand the availability of 10+ GB LPDDR DRAM to address the increasing needs of global smartphone makers for higher-capacity memory solutions, while reinforcing its competitive edge in the memory marketplace.